发明名称 |
Chip layout of semiconductor integrated circuit |
摘要 |
A chip layout of a semiconductor integrated circuit, includes a plurality of device patterns that are designed to form a semiconductor substrate having a single power supply; and a metal wiring pattern, which is to be formed on the semiconductor substrate. The metal wiring pattern is divided into plural parts to provide a plurality of power-supply channels.
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申请公布号 |
US5952684(A) |
申请公布日期 |
1999.09.14 |
申请号 |
US19970976604 |
申请日期 |
1997.11.24 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TASHIRO, MASAHISA |
分类号 |
H01L21/822;H01L21/82;H01L27/04;H01L27/118;(IPC1-7):H01L27/118 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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