发明名称 Chip layout of semiconductor integrated circuit
摘要 A chip layout of a semiconductor integrated circuit, includes a plurality of device patterns that are designed to form a semiconductor substrate having a single power supply; and a metal wiring pattern, which is to be formed on the semiconductor substrate. The metal wiring pattern is divided into plural parts to provide a plurality of power-supply channels.
申请公布号 US5952684(A) 申请公布日期 1999.09.14
申请号 US19970976604 申请日期 1997.11.24
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 TASHIRO, MASAHISA
分类号 H01L21/822;H01L21/82;H01L27/04;H01L27/118;(IPC1-7):H01L27/118 主分类号 H01L21/822
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