发明名称 PRODUCTION OF METALLIZED ALUMINUM NITRIDE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To form a metallized pattern in good accuracy with excellent joint strength even after a high temp. treatment such as brazing and soldering by applying a mixture of a brazing material and an active metal on the surface of an aluminum nitride substrate, laminating a metal sheet thereon, heating it and then, removing the brazing material and the metal sheet. SOLUTION: A brazing material having <=45μm average particle size comprising a mixture powder of Ag and 20 to 80 wt.% Cu is mixed with 0.2 to 10 wt.% of active metals having <=45μm average particle size comprising a group IVa and Va metals in the periodical table and their hydrogenated compds. to obtain a mixture. The mixture is uniformly applied to 20 to 50μm thickness on the surface of an aluminum nitride substrate, dried in air at 120 to 200 deg.C and then, a oxygen-free metal plate of 50 to 300μm thickness is laminated on the substrate. The laminated body is heated in <=1×10<-4> Torr vacuum or nonoxidizing atmosphere having <=10 ppm oxygen concn., at a temp. higher than the melting point of the brazing material. Then, the brazing material and the metal sheet are removed.
申请公布号 JPH11246289(A) 申请公布日期 1999.09.14
申请号 JP19980049177 申请日期 1998.03.02
申请人 TOKUYAMA CORP 发明人 KAMIYAMA YOSHIHIDE;MITSUNABE YUICHIRO
分类号 B23K1/19;B23K35/22;C04B41/88;H05K1/03;H05K3/00;(IPC1-7):C04B41/88 主分类号 B23K1/19
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