发明名称 Monolithically integrated planar semi-conductor arrangement with temperature compensation
摘要 PCT No. PCT/DE96/01073 Sec. 371 Date Jan. 9, 1998 Sec. 102(e) Date Jan. 9, 1998 PCT Filed Jun. 18, 1996 PCT Pub. No. WO97/04486 PCT Pub. Date Feb. 6, 1997A semiconductor, where a region is introduced into a semiconductor substrate and, together with this substrate, forms a p-n junction. Provision is made in the vicinity of the space charge region being formed for a covering electrode and a heavily doped region. The covering electrode is coupled to a voltage divider, through which the potential of the covering electrode is adjusted with temperature compensation.
申请公布号 US5952705(A) 申请公布日期 1999.09.14
申请号 US19980981985 申请日期 1998.01.09
申请人 ROBERT BOSCH GMBH 发明人 MICHEL, HARTMUT;PLUNTKE, CHRISTIAN;GOERLACH, ALFRED
分类号 H01L29/73;H01L21/331;H01L21/8222;H01L27/02;H01L27/06;H01L29/06;H01L29/40;H01L29/732;H01L29/78;(IPC1-7):H01L29/70;H01L29/735 主分类号 H01L29/73
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