发明名称 Method of roughing a metallic surface of a semiconductor deposition tool
摘要 The present invention provides a method of roughing a metallic surface. In one embodiment, the method includes the steps of positioning a pressurized grit source a predetermined distance from and at an angle substantially perpendicular to the metallic surface of the object that is to be roughened, projecting grit from the pressurized grit source against the metallic surface, forming a grit impact area, which in certain embodiments may be seven inches square, on the metallic surface, and moving the pressurized grit source from the grit impact area after an amount of time that ranges from about three seconds to about eight seconds.
申请公布号 US5951372(A) 申请公布日期 1999.09.14
申请号 US19970970298 申请日期 1997.11.14
申请人 LUCENT TECHNOLOGIES INC. 发明人 CHOQUETTE, SCOTT F.;DANIEL, TIMOTHY J.;WOLFSON, CRISTIN A.
分类号 B24C1/06;C23C14/56;(IPC1-7):B24B1/00 主分类号 B24C1/06
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