发明名称 Double side grinding apparatus and double side polishing apparatus
摘要 <p>A double side grinding apparatus and a double side polishing apparatus capable of narrowing the tolerance range, reducing pitching errors, and ensuring a sufficient level of rigidity against the force of reaction to machining while enhancing the positioning accuracy. A double side grinding apparatus or a double side polishing apparatus in which a plurality of guide ways (14a, 14b, 14c)for supporting and shifting main spindles (13)are formed, and a driving point composed of a plurality of the guide ways (14a, 14b, 14c)is matched with the center of gravity of the main spindles(13). The number of the guide ways is preferably three in order not to prevent them from obstructing the bringing in and out of a work. &lt;IMAGE&gt;</p>
申请公布号 EP0940220(A1) 申请公布日期 1999.09.08
申请号 EP19990102802 申请日期 1999.02.25
申请人 SUPER SILICON CRYSTAL RESEARCH INSTITUTE CORP.;SUMITOMO HEAVY INDUSTRIES, LTD. 发明人 ABE, KOHZO;ISOBE, SHO;TOMITA, YOSHIYUKI;HARA, KAZUTOSHI;MASAKI, RYUZO;IWASE, AKIO;NAGATA, HIROSHI
分类号 B23Q1/26;B23Q1/70;B24B7/17;B24B41/02;(IPC1-7):B24B7/17 主分类号 B23Q1/26
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