发明名称 SLIT BASE MATERIAL TAKE-UP DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a take-up device that takes up multilines of lead frame strips that are slit from a lead-frame base material paged in multilines and subjected to terminal formation by photo-etching, stably or without deteriorating their quality. SOLUTION: A slit base material take-up device comprises a plurality of spools 32 fitted on a driveshaft 31, a power source 41 for rotating the driveshaft 31, a plurality of guide rollers 33 located on the upstream side of the spools 32 to guide multilines of a base material 2 slit toward the spools 32, and feed rollers 20 located on the upstream side of the guide rollers 33 to deliver the slit base material multilines 2. Between the guide rollers 33 and feed rollers 20, a sag space 34 is defined where the base material 2 is allowed to sag down by its deadweight, in which space 34 pairs of detectors 42a, 42b and 43a, 43b are placed to detect any sag of the base material 2. The multilines of the slit base material 2 are wound about the spools 32 through control of the rotational frequency of the power source 41 for driving the spools 32 on the basis of sag detection signals from the detectors 42a, 42b, 43a and 43b.
申请公布号 JPH11240653(A) 申请公布日期 1999.09.07
申请号 JP19980059064 申请日期 1998.02.25
申请人 DAINIPPON PRINTING CO LTD 发明人 KOTANI KEIICHI;NAKAMURA KENJI
分类号 B26F3/02;B21C47/02;B21C47/26;B65H18/10;B65H23/195;H01L23/50;(IPC1-7):B65H23/195 主分类号 B26F3/02
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