| 摘要 |
An electrostatic chucking mechanism including an electrode body, a dielectric block placed on the front of the electrode body and having a dielectric portion to be dielectrically polarized for electrostatically chucking an object to be chucked, and an intermediate layer placed between the electrode body and the dielectric block. The intermediate layer is formed of a metal such as indium having extendibility for absorbing thermal deformation of the electrode body or the dielectric block and is heated and pressurized, thereby joining the electrode body and the dielectric block. A thin film of indium, chrome, or the like, is prepared on the junction face of the dielectric block, enhancing a junction force and adhesion by the intermediate layer.
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