| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a water inspecting method for improving the precision of focusing for the inspection of an object which has many pattern components longitudinally and laterally. SOLUTION: This is a wafer inspecting method for inspecting as an object a pattern formed on the surface of a water. An automatic focusing microscope apparatus, with which the object is irradiated with linear laser beam and controls the focus according to its returning beam, is used to scan the wafer W with obliquely irradiating laser light and to determine the focus, and then the inspection is performed by the microscope apparatus. Consequently, since the method the light reflected by the pattern on the wafer is the returned light which is sufficient in quantity, the accuracy is improved sufficiently as compared with conventional accuracy and the image of the obtained pattern shape becomes sharp. For this purpose, by having the inspection performed on the basis of the focus which is obtained with high accuracy, the precision of the inspection itself is improved.</p> |
