| 摘要 |
A heat radiating device capable of reducing electromagnetic interference, including a circuit board disposed with a CPU and more than one heat dissipating IC (or chip set) and a housing composed of an upper and a lower heat conductive casings for enclosing the circuit board. The upper and lower heat conductive casings respectively thermally conductively contact with the heat dissipating surface and back face of the CPU and thermally conductively contacting with the heat dissipating surfaces of the heat dissipating IC from two faces of the circuit board. After the CPU and the heat dissipating IC are enclosed by the upper and lower heat conductive casings, the heat radiating area is increased and the electromagnetic interference to the CPU and the heat dissipating IC from other electronic elements is greatly reduced. The heat radiating device further includes a heat-pipe. One end of the heat-pipe is fixed between the upper/lower heat conductive casings and the CPU to contact with the CPU together with the upper/lower heat conductive casings so as to conduct the heat to the other end of the heat-pipe for forcedly radiating the heat.
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