| 摘要 |
A method of forming image sensor packages may include a step of performing a molding process. A mold material may be formed either on a transparent substrate between image sensor dies, or on a removable panel between transparent substrates attached to the image sensor dies. Redistribution layers may be formed before or after the molding process. The mold material may be formed after forming redistribution layers so that the mold material covers the redistribution layers. In these cases, holes may be formed in the mold material to expose solder pads on the redistribution layers. Alternatively, the redistribution layers may be formed after the molding process, and the redistribution layers may extend over the mold material. The image sensor dies may be attached to a glass or notched glass substrate with dam structures. Methods of forming image sensor packages may result in hermetic image sensor packages that prevent exterior materials from reaching the image sensor. |
