| 摘要 |
PROBLEM TO BE SOLVED: To obtain an anisotropically conductive adhesive which exhibits a high electric conduction reliability and a high elecric insulation reliability even when an IC with a small bump or pitch is connected by dispersing, in an insulating adhesive, conductive particles which comprise at least two kinds of conductive particles different in average particle size and coated with an insulating resin insoluble in the insulating adhesive. SOLUTION: A film 10 for anisotropic conductive adhesion is prepd. by dispersing conductive particles 11 having a smaller average particle size and conductive particles 12 having a larger average particle size in an insulating adhesive 13. An IC chip 14 forms a bump 15; and a circuit board 16 forms a wiring pattern 17. The conductive particles 11, 12 are formed by coating the surfaces of polymeric core particles with a metal plating layer and then with an insulating resin layer. The film 10 for adhesion in the state of being inserted is thermally press bonded under heating and pressure. The insulating resin layer of the larger-size particle 12 between the bump 15 and the wiring pattern 17 is softened, melted, ruptured, and excluded, and the film becomes electrically conductive through the metal plating layer. The film becomes electrically conductive in the same way at the site of the smaller size particle, too. |
