发明名称 MOLD-RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To provide a mold-release film excellent in surface smoothness, especially, in surface smoothness at a time of high temp. and useful for a resin sheet or film molded from a resin soln., a molding carrier film such as a ceramic sheet or the like molded from a ceramic slurry or a protective film of a self-adhesive layer of a self-adhesive tape or the like. SOLUTION: A mold-release film comprises a polyalkylene 2,6- naphthalenedicarboxylate containing 0.005-5 wt.% of inert particles and is characterized by that the absolute value of the dimensional change ratio of the mold- release film under a stress of 150 gf/mm<2> at 120 deg.C is 0.2% or less in both of longitudinal and vertical directions and the number of particles with a particle size of 50μm or less in the film is 100/m<2> or less and the surface roughness of the mold-release surface of the film is 2-50 nm.
申请公布号 JPH11240110(A) 申请公布日期 1999.09.07
申请号 JP19980043698 申请日期 1998.02.25
申请人 TEIJIN LTD 发明人 SUMI HIROYUKI
分类号 B32B27/00;B29D7/01;B29K23/00;B32B27/36;C08K3/36;C08L67/02;(IPC1-7):B32B27/00 主分类号 B32B27/00
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