| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive paste composition that has improved peel strength against a lead frame, especially against a copper lead frame, and prevents the generation of chip crack and chip warpage by reducing the stress of the adhesive paste composition and, when a copper lead frame is used, is free from reflow crack and provide a semiconductor device using the composition. SOLUTION: An adhesive paste composition is produced by uniformly dispersing (A) a reaction product obtained by reacting an isocyanate-terminated urethane prepolymer with an acid anhydride represented by the formula (wherein each R<1> and R<2> represents independently a hydrogen atom or a short chain alkyl group) and (B) a radical initiator and (C) a filler. A semiconductor device is provided by bonding a semiconductor element to a supporting member with the use of the adhesive paste composition and thereafter sealing.</p> |
