| 摘要 |
<p>The contact pin (8) contains a preformed solder blob (34), which has a preset deposition face (36) for inserting onto a contact surface of a module carrier, with the deposition face flat. Typically the component has several contact pins, each with a solder blob whose deposition faces located in the plane. The electronic component of the SMT type manufacturing starts with contact pin insertion on a processing support (10), containing an arrangement of depressions filled with solder paste, corresponding to number and geometrical pattern of the contact pins, followed by heat treatment and support motion.</p> |
