发明名称 MEMS PRESSURE SENSOR AND METHOD FOR FORMING THE SAME
摘要 Provided are a MEMS pressure sensor and a method for forming the MEMS pressure sensor. The method includes: preparing a first substrate, where the first substrate includes a first surface and a second surface opposite to the first surface; preparing a second substrate, where the second substrate includes a third surface and a fourth surface opposite to the third surface, the second substrate includes a pressure sensing region; bonding the first surface of the first substrate and the third surface of the second substrate with each other; forming a cavity between the first substrate and the pressure sensing region of the second substrate; removing the second base to form a fifth surface opposite to the third surface of the second substrate; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer.
申请公布号 US2016236932(A1) 申请公布日期 2016.08.18
申请号 US201615013408 申请日期 2016.02.02
申请人 MEMSEN ELECTRONICS INC 发明人 CHAU MANHING
分类号 B81C1/00;B81B7/00 主分类号 B81C1/00
代理机构 代理人
主权项 1. A method for forming a Micro-Electro Mechanical System (MEMS) pressure sensor, comprising: preparing a first substrate, wherein the first substrate comprises a first surface and a second surface opposite to the first surface, and the first substrate comprises at least one conductive layer arranged on the side of the first surface of the first substrate; preparing a second substrate, wherein the second substrate comprises a third surface and a fourth surface opposite to the third surface, the second substrate comprises a second base and a piezoresistive element arranged on or above the second base, the second substrate comprises a pressure sensing region in which the piezoresistive element is arranged, and the piezoresistive element is arranged on the side of the third surface of the second substrate; bonding the first surface of the first substrate and the third surface of the second substrate with each other; forming a cavity between the first substrate and the pressure sensing region of the second substrate; removing the second base to form a fifth surface opposite to the third surface of the second substrate; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer, wherein the first conductive plug is used to electrically connect the conductive layer to the piezoresistive element.
地址 Tianjin CN