METHOD OF PRODUCING SEMICONDUCTOR DEVICES INCLUDING A STEO OF DICING A SEMICONDUCTOR WAFER WHILE COVERING THE SEMICONDUCTOR WAFER BY A TAPE

摘要

A method of producing semiconductor devices includes the steps of disposing an adhesive tape over a wafer such that an adhesive surface of said tape faces a top surface of said wafer, disposing a flexible urging member over the tape in a state that the flexible urging member causes a deformation by a gravity such that the flexible urging member causes a bulging in a downward direction toward the adhesive tape, moving the flexible urging member relatively to the adhesive tape in engagement with the adhesive tape such that the adhesive tape is deformed in conformity with the flexible urging member and the adhesive tape causes a bulging in a downward direction toward the wafer, and contacting the deformed adhesive tape on the top surface of the wafer.