Compound semiconductor device having reduced temperature variability

摘要

A semiconductor device (20) is formed on a compound semiconductor substrate (21). The semiconductor device (20) is oriented on the surface (40) of the compound semiconductor substrate (21) such that the physical forces that result from the thermal heating or cooling of the compound semiconductor substrate (21) are essentially equal. This orientation reduces the variability of the drain to source current of the semiconductor device (20) as the semiconductor device (20) is operated at different temperatures.