发明名称 LAMINATE MOLDING METHOD AND APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a laminate molding method and apparatus for laminating a member to be laminated so as to embed the projected parts thereof in the resin layer to mold a molded product having a smooth surface. SOLUTION: A laminate molding apparatus is equipped with upper and lower plates 2 provided in mutually opposed relationship so as to be capable of relatively approaching and separating, an electric heater 3 melting the resin layer of a molding material H1 to be laminated, the film member 4 provided to the opposed surface of the lower plate 2, the smooth pressure surface 5 formed to the opposed surface of the upper plate 1, a frame member 6 forming a molding space K housing the molding material H1 to be laminated by holding the same between the opposed surfaces of the upper and lower plates 1, 2, a suction means 7 evacuating the formed molding space K, the elastically deformable pressure plate 8 interposed between the film member 4 and the material H to be molded and a close contact/pressure means 9 bringing the film member 4 into close contact with the opposed surface of the lower plate 2 arbitrarily and separating the same from the opposed surface of the lower plate 2 to press the molding material H1 to be laminated between the lower plate and the pressure surface 5 of the upper plate 1 through the pressure plate 8.</p>
申请公布号 JPH11235754(A) 申请公布日期 1999.08.31
申请号 JP19980178422 申请日期 1998.06.25
申请人 MEIKI CO LTD 发明人 OGAWA AKIHIKO
分类号 B42D15/10;B29C43/18;B29C43/56;B29C51/12;B29C51/14;B29K105/06;B32B37/00;H05K3/00;(IPC1-7):B29C51/12;B32B31/00;B29D9/00 主分类号 B42D15/10
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