发明名称 MULTIPLE POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a multiple polishing device wherein necessity for a robot between adjacent polishing units is eliminated to decrease the number of robots to be used, a cost is reduced, and the device is miniaturized. SOLUTION: This constitution is formed such that a block transfer mechanism 12 having a block guide 16 freely displaceable between a first position in contact with a block 5 on a surface plate 3 and a second position not in contact with the block is provided between adjacent polishing units 1, 1, and by this block guide 16, the block 5 provided on the surface plate 3 of the polishing unit 1 in a front step is made to sideslip so as to be moved onto the surface plate 3 of the polishing unit 1 in a rear step.
申请公布号 JPH11226867(A) 申请公布日期 1999.08.24
申请号 JP19980050149 申请日期 1998.02.16
申请人 SPEEDFAM CO LTD 发明人 NAGAYAMA HITOSHI
分类号 B24B37/04;B24B41/06 主分类号 B24B37/04
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