Package structure for high-power surface-mounted electronic devices

摘要

An electronic device structure includes a ceramic base and a ceramic lid. The base has a ceramic body with sides and a bottom defining an interior cavity of the ceramic body. There is a first body aperture through the bottom of the ceramic body, a first metallic base pad affixed to an exterior of the bottom of the ceramic body and overlying the first body aperture, a second aperture through the bottom of the ceramic body, and a second metallic base pad affixed to an exterior of the bottom of the ceramic and overlying the second aperture. The second base pad has a second base pad aperture therethrough aligned with the second aperture. A bonding button is positioned within the interior cavity and overlying the second aperture. The bonding button is formed of a bonding pad in the interior of the ceramic and an integral connector extending through the second aperture and the second base pad aperture and affixed to the second base pad. A high-power electronic device such as a power MOSFET is affixed to an interior surface of the first metallic base pad, and a wire interconnector extends from the electronic device to the bonding pad of the bonding button.