发明名称 HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM
摘要 An electrical interconnect system includes a support element; and an array of groups of multiple electrically conductive contacts arranged on the support element such that at least one contact of each group includes a front surface facing outwardly and away from that group along a line initially intersected by a side surface of a contact from another one of the groups of the array. The groups may be arranged in a configuration such that the array has a density of at least 500, 600, or 1,000 contacts per square inch.
申请公布号 EP0749639(B1) 申请公布日期 1999.08.25
申请号 EP19950913542 申请日期 1995.03.09
申请人 CRANE, STANFORD W., JR. 发明人 CRANE, STANFORD W., JR.
分类号 H01R13/04;H01R12/50;H01R12/71;H01R12/85;H01R13/193;H01R13/26;H01R24/00;H01R24/60 主分类号 H01R13/04
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