Methods of electroplating solder bumps of uniform height on integrated circuit substrates

摘要

A method of electroplating solder bumps on an integrated circuit substrate containing a plurality of active semiconductor devices in the substrate and a plurality of contact pads electrically connected to the active semiconductor devices, comprising the steps of:
forming a plating base layer which electrically shorts the plurality of contact pads together, on the substrate; and
electroplating solder bumps on the plating base layer by drawing plating current vertically through the substrate via a first plurality of parallel electrical paths formed by the plating base layer and the plurality of active semiconductor devices.