| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device, without variations in chip mounting position during resin encapsulation. SOLUTION: A lead frame 1 with a die pad 3 smaller than the size of a semiconductor chip is used, and a hanging lead 4 and an inner lead part 5a are connected with an insulating tape 6. In this way, since the inner lead part 5a and the hanging lead 4 are connected with the insulating film, vibrations in the positions of the inner lead part 5a and the hanging lead 4 is prevented, and the semiconductor-chip mounting position is prevented from shifting. Then, the rate of flow of molten resin on the top surface side of the semiconductor chip and on the underside of the semiconductor-chip mounting part are made almost equal, and defects like through-voids can be prevented. |
