| 摘要 |
A heat sink assembly including a heat sink having a plurality of equi-distantly spaced cooling fins. The heat sink body has a depression on one side for receiving a cooling and is fixedly provided above integrated circuits of the electronic product, with a layer of thermal conductive plate disposed therebetween. The heat generated by the integrated circuit elements during operation process is transferred to the cooling fins via the thermal conductive plate. Simultaneously, the cooling fan draws in air, which is discharged, via an air outlet thereof towards the cooling fins to dissipate the heat of the cooling fins. The cooling fan can be disposed directly above the heat sink body to enhance heat dissipation efficiency. A single cooling fan will suffice to achieve good heat dissipating effects, thus reducing manufacturing cost.
|
