| 摘要 |
An automated vision scribing and breaking process for a membrane supported die array (D) on a transfer table wherein the die array is mounted on a membrane (M), the array and individual dies of the array are accurately positioned for scribing or breaking with the assistance of machine vision (C), and the array is scribed by a scribe (S) and/or broken by an underlying breaker bar (B) into individual dies. The dies are individually recognized, angularly aligned to be normal to the underlying and supporting breaker bar. The dies are individually scribed, preferably, by "skip scribing" to avoid edging that might interfere with subsequent chip performance. As each die is independently scribed, automated indexing occurs to compensate for membrane stretching. Once properly scribed to the desired dimension, these dies can be further processed including utilizing the scribes to produce square ends to produce precise reflective laser cavities.
|
