| 摘要 |
An electronic card having an integrated circuit 3 is manufactured by hot laminating using a surface film or overlay 8,9 pierced with through holes 14 so that air bubbles trapped between the overlay and outer layers 4,7 can escape. The holes may have a diameter of 0.2-1.4 mm, a pitch of 2-20 mm and cover 0.1-2.5% of the film surface area. The overlay 14 may be in the form of a single film which covers the layers 4,7, prior to laminating, in the manner of a book (Fig 4). |
