Process for fixing an electronic module in a recess of a body of a portable object, in particular a card body, by ultrasonics

摘要

An electronic module (20) is transferred to a cavity (30) of a portable object (10) and the module (20) is then subjected to ultrasonic treatment so that the thermoplastic regions of the cavity (30) reach their vitreous transition temperature. The contact zones (21) of the electronic module are supported on a substrate (22). Prior to mounting of the module, the substrate may be treated so that the face opposite to the cavity (30) has a layer of micro-cavities. An Independent claim is made for a device for fixing of an electronic module into a transport medium such as a card.