| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly efficient method of optical edge bead remover of semiconductor wafer, by which a resist can be removed accurately from the end sections of orientation flat sections, and at the same time, the treatment time can be shortened, and a device used for the method. SOLUTION: Orientation flat sections 2A of semiconductor wafers 2 set in a wafer cassette 3 in multiplex stages are aligned with each other, by bringing the orientation flat sections 2A of the wafers 2 into contact with a semiconductor wafer positioning roller 4 which is set in a vertical position, which the top of the roller 4 being slightly inclined outward. Then the wafers 2 set in the multiple stages are turned by 180 deg. by rotating the roller 4 around the axis of the roller 4, while the wafers 2 are in contact with the roller 4 and the orientation flat sections 2A of the wafers 2 are shifted step-like from each other by further tilting the top of the roller 4 outward. Then the shifted orientation flat sections 2A are exposed collectively.</p> |
