| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of obtaining flatness with high precision by appending a member of simple structure or an inexpensive member for general purpose in the case that the flatness of a wafer is not sufficient in the preceding process, in a chemo-mechanical polishing method using a waxless mount method. SOLUTION: In a sheet type polishing device performing polishing in a condition that the center of rotation of a wafer 10 coincides with the center of rotation of a polishing head 4 supporting this wafer 10, in the case of the wax-less sheet type device in particular, for holding the wafer 10 by the polishing head 4 and a packing pad 6 without using wax, a sheet body 2 of rotation symmetry is arranged in a part corresponding to a protruded side part of flatness of the wafer 10 at polishing preceding process time of the polishing head 4 and the packing pad 6, and a surface pressure in this protruded side part is increased to perform polishing. |
