Heat radiating structure of electronic device

摘要

The heat radiating structure of an electronic device according to the present invention comprises upper and lower shielding cases, a printed circuit board disposed between the upper and lower shielding cases, and a heat radiating member mounted to the board to absorb and radiate heat which is generated from a heat generating component. Heat conduction members formed of an insulating material are disposed respectively on upper and lower end sides of the heat radiating member so as to be abutted against the upper and lower shielding cases.