| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of a harmful exhaust gas by providing the apparatus with a catalytic thermal decomposition device for treating an organic exhaust gas generated in the treatment and a gas cleaning device. SOLUTION: A waste printed circuit board 1 is heated to a temp. equal to or higher than the melting temp. of a solder by a heating device 2a. The waste printed circuit board 1 is separated into a substrate 3a, electronic parts 3b and the solder 3c by impressing external force by an external force impressing device 2b while keeping the melting state of the solder. The exhaust gas generated in the treating stage is made harmless by passing through the catalytic thermal decomposition device 4 and the waste gas cleaning device 5 and discharged as a harmless exhaust gas 6. An oxidation catalyst, for example, containing TiO2 , WO3 and SiO2 and having Ti : W : Si = about 7 : about 2 : about 1 is used in the exhaust gas catalytic thermal decomposition device 4. A spray injecting system or the like is used in the waste gas cleaning device 5. As a result, the generation of the harmful gas is prevented. |
