SEMICONDUCTOR DEVICE MANUFACTURING CARRIER

摘要

PROBLEM TO BE SOLVED: To protect a semiconductor device against cracking caused by warpage even if a metal frame is used by a method wherein the metal frame bonded in the periphery of the one side of an insulating tape is prescribed in linear expansion coefficient. SOLUTION: A semiconductor device manufacturing carrier is composed of an insulating flexible tape 2 and a metal frame 1. A wiring layer formed of copper foil or the like is provided in both sides or one side of the flexible tape 2. The wiring layer is formed into a prescribed wiring pattern in a region 14. Transfer holes are provided in the periphery of the metal frame 1 to transfer the carrier. The metal frame 1 (Fig. a) is equipped with an opening 16 at its center corresponding to the wiring layer region 14 of the flexible tape 2. Adhesive agent 3 is provided in the one side of the metal frame 1 surrounding the opening 16. The metal frame 1 has a linear expansion coefficient of 11.5 ppm/k to 17.5 ppm/k. For instance, copper alloy can be applied to the metal frame 1.