| 摘要 |
PROBLEM TO BE SOLVED: To easily vary the temperature of a heat treatment reducing an increase in manufacturing cost to an irreducible minimum by a method wherein a control device controls a heating means which heats a target substrate and a cooling means which cools down the heating means coming into contact with or parting from it. SOLUTION: A heat treatment plate 58, a cooling plate 102, and a main arm drive motor M are connected to a control device 120 respectively, and the temperature of a cooling body which a cooling device 104 cools down and a time required for cooling down the heat treatment plate 58 by placing the cooling body cooled down by the cooling device 104 are controlled resting on the basis of the temperature of the heat treatment plate 58 before it is cooled down and the temperature of a heat treatment carried out in a following heat treatment process which a wafer undergoes. By this setup, an existing device is capable of easily varying the temperature of a heat treatment through a minimal modification without making it complicated or increasing its manufacturing cost much, and efficiently cooling down the heat treatment plate in the shortest time. |
