| 摘要 |
PROBLEM TO BE SOLVED: To improve bonding of a polymer-shaped substance to a copper surface by chemically reducing a copper oxide surface, by allowing the surface to be brought into contact with a bonding-accelerating composition, by depositing metal selected from a group consisting of nickel and palladium on the surface, and by bonding the copper surface to a resin-shaped layer. SOLUTION: A copper surface is cleaned and is subjected to microetching, the copper surface is oxidized, and the whisker or peak of a brown or black oxide is generated. Then, the copper oxide surface is chemically reduced, the surface is brought into contact with a bonding-accelerating composition containing metal and/or a reducing agent being selected from a group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron, and the alloy of the metals, the selected metal is deposited onto the surface, and then the copper surface is bonded to a resin-shaped layer, thus improving the bonding of a polymer-shaped substance to a copper surface. |
