| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor mount device which can reduce damage to the surface of a semiconductor chip, and also can realize reliable fixing to a mount part. SOLUTION: A semiconductor chip 24 is sucked by a collet 25 provided in a tip end of a holder 27 and held thereat, and then fixed to a mount part of a lead frame by silver paste. The holder 27 has a cylinder member 39 which is formed with a through-hole 40 in its side wall. The holder is inserted in the cylinder member 39 so that a predetermined gap 38 is provided between the collet 25 and the cylinder member 39, and the holder is reciprocatably moved in an axial direction against compression of a spring 41. The cylinder 39 is retreated with the spring 41 compressed by the chip 24 sucked and held by the collet 25. At the time of mounting, the suction is released so that the compressed spring 41 causes the holder to advance and push the chip 24. At the same time, a high compressed air heated at a predetermined temperature by a heater 36 is blown against the chip 24 to apply a mounting load and fix it. |
