ROTARY DRYING DEVICE AND ROTARY DRYING METHOD

摘要

PROBLEM TO BE SOLVED: To make it possible to dry evenly the whole surface of a material to be dried without restricing the placement of the material to be dried and without increasing the size of the material to be dried by a method wherein a rotary drying device is provided with a second driving means, which is parallel to the first axis of rotation of the material and is rotated on the second axis of rotation of the material at a prescribed interval from the first axis of rotation. SOLUTION: A first driving motor 2 is provided on the upper surface of a rotating carriage 3 and a semiconductor wafer W is rotated on the rotating carriage 3 relatively to the carriage 3. Therefore, a second central point P2 of rotation on a second axial line R2 of rotation of the wafer W is moved in a circular locus centering around a first central point P1 of rotation on a first axial line R1 of rotation of the wafer W as shown by one dotted chain lines in (A). Thereby, as a centrifugal force works also on the part in the vicinity of the central point P2 of rotation of the wafer W, the whole surface of the wafer W can be dried. Moreover, the wafer W can be arranged on the second axial line R2 of rotation without being restricted its arrangement and moreover, a miniaturization of a rotary type drying device can be contrived.