| 摘要 |
PROBLEM TO BE SOLVED: To make a gap between a semiconductor chip and a wiring board constant by a method wherein a spacer, the height of which is equal or lower than that of a projected electrode, is formed at least three positions, and an electric connection is made only on the projected electrode. SOLUTION: In a semiconductor chip 1, a electronic circuit is formed on a silicon board, and an electrode is formed by Al, etc., as an external terminal of the electronic circuit. To make an electric connection with an electrode pad 6 of a wiring board 5 on the electrode, a projected electrode 2 is formed by solder having Sn by Pb composition ratio of 6:4. By using high melting point solder having 5 Sn/95 Pb, a melting point of which is higher than that of the projected electrode 2, or by using a resin material having a linear expansibility of 20 to 30 ppm/ deg.C., a spacer 3, the height of which is equal or less than that of the projected electrode 2 is formed, and the projected electrode only is electrically connected with the wiring board 5 through the pad 4. |
