| 摘要 |
<p>PROBLEM TO BE SOLVED: To excellently and readily make mechanical and electrical connection between a lead part and a pad part of a semiconductor element. SOLUTION: A lead part 3 and a circuit part 4 are provided on an insulation base body 2, and a frontal part of the lead part 3 is formed extending from above the insulation base body 2. Here, there is prepared a connection base material 1 in which a bump 12 is formed by a material forming the lead part 3 in a frontal connection part of the lead part 3, and a pad part 19a of a semiconductor element (chip) 19 is connected to the bump 12 of the frontal connection part of the lead part 3 in the connection base material 1.</p> |
