发明名称 DEVICE AND CIRCUIT BOARD MOUNTED WITH THE DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To reduce weight and provide a low moisture absorbing characteristic, high heat resistance, moisture absorption dimensional stability, thermal dimensional stability and excellent electrical characteristics, by using liquid crystal polymer film as an insulating board, and forming a conductor on the board. SOLUTION: A liquid crystal polymer film having a film thickness of approximately 50μm and a molecular orientation of 1.3 or more is manufactured by using a liquid crystal polymer, which is a copolymer of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, having a melting point of approximately 283 deg.C, by molten protrusion and inflation molding. Then, a copper foil 3, i.e., a metal foil, having a thickness of approximately 18μm is thermally press-bonded on the liquid crystal polymer film 2, and a laminate composed of the combination of the copper foil and the liquid crystal polymer film is manufactured. Then, the laminate is heat-treated, and the thermal expansion coefficient of the film 2 is permitted to be the same as that of the copper 3 to be used as conductor. Then, a thin film capacitor 1 is manufactured by using the heat-treated laminate.</p>
申请公布号 JPH11214250(A) 申请公布日期 1999.08.06
申请号 JP19980015361 申请日期 1998.01.28
申请人 KURARAY CO LTD 发明人 YOSHIKAWA ATSUO;ONODERA MINORU
分类号 H01C7/00;H01G4/33;H05K3/46;(IPC1-7):H01G4/33 主分类号 H01C7/00
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