| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing optical semiconductor elements wherein leads connected to electrodes of a thermoelectric cooling element such as Peltier element can be connected to a metallized wiring layer at a ceramic terminal part without causing electric short-circuiting between adjacent metal lized wiring layers and as the result contained thermoelectric cooling element and optical semiconductor element can be always normally operated. SOLUTION: The package for housing optical semiconductor elements comprises a base 1 on the top face center of which an optical semiconductor element 4 is mounted through a thermoelectric cooling element 5, frame 2 bonded to the top face of the base 1, ceramic terminal part 7 which pierces the frame 2 and has a metallized wiring layer 12 to which electrodes of the thermoelectric cooling element 5 are connected through leads 15, and cover 3 bonded to the top face of the frame 2. To the metallized wiring layer 12 a metal terminal 17 is bonded with its one end projected from the ceramic terminal part 7. Hence the leads 15 connected to electrodes of a Peltier element can be connected to the metallized wiring layer 12, without causing electric short circuit between adjacent metallized wiring layers 12. |
