| 摘要 |
PROBLEM TO BE SOLVED: To fabricate an intermediate body wherein prepregs and a substrate for an inner layer are bonded into an integral unit, by putting a united substrate made by connecting a plurality of substrates in parallel for an inner layer in the horizontal direction between the prepregs constituted of a thermosetting resin composition and a basic material to form the intermediate body, then placing metal foils on both sides of the intermediate body to form a pressurized body, and then heating and pressurizing the pressurized body. SOLUTION: A substrate 11 for an inner layer is made by bonding basic materials with thermosetting resin and the like such as epoxy resin unsaturated polyester resin and then a conductor circuit is formed on the board. As a method for fabricating a prepreg 12, a solvent is added into a thermosetting resin composition and the viscosity of the liquid is adjusted and then a basic material is dipped in the liquid to impregnate the basic material with the liquid, and after that, the basic material is heated to dry the solvent and half-harden the thermosetting resin composition and thus the prepreg 12 is fabricated. For the basic material, inorganic fiber such as glass, polyester and the like, or unwoven cloth or paper can be used. The united substrate 10 and the prepregs 12 are so stacked that the prepregs 12 may be brought into contact with both faces of the united substrate 10 and these are stuck to each other with a sticking agent. |
