| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance heat-resistance by a method wherein a mold resin is formed so that a ratio of the thickness of the mold resin on a front surface side of a semiconductor chip to the thickness of the mold resin on a back surface side of the semiconductor chip is set in a specified range. SOLUTION: A semiconductor chip 1 is connected to a chip support part 2a arranged at four corners of one main face via adhesives 3, and a pad part formed on the semiconductor chip 1 is connected to a lead part 5 via a wire 4. The semiconductor chip 1, the chip support part 2, the wire 4 and the lead part 5 are sealed with a mold resin 6 injection-molded. In this mold resin 6, when the thickness on a front surface side of the semiconductor chip 1 is L1 and the thickness on a back surface side of the semiconductor chip 1 is L2, molding is performed so that a ratio L1/L2 of the thickness L1 to the thickness L2 is set to 0.85<=L2<=1.45. Thus, a void and an unfilled state are not generated and heat-resistance can be improved.</p> |
