| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which does not deteriorate the electrical insulation between wiring conductors by suppressing the reaction between the copper contained in metallic powder and the bromine contained in an insulating substrate by forming the wiring board by sticking the wiring conductors formed by coupling metallic powder composed of copper coated with silver with a thermosetting resin to the surface of the insulating substrate formed by coupling inorganic insulator powder with a thermosetting resin. SOLUTION: A wiring board is formed by sticking wiring conductors 2 formed by coupling copper alloy powder coated with silver with a thermosetting resin to an insulating substrate 1 formed by coupling inorganic insulator powder with a thermosetting resin. The copper alloy contains 0.05-0.2 wt.% yttrium in copper. Since the reaction between the copper contained in the conductors 2 and the bromine contained in the substrate 1 is suppressed, the occurrence of such a phenomenon that copper bromide is precipitated between the conductors 2 and lowers the electrical insulation between the conductors 2 can be prevented.
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