An integrated circuit chip (12) arranged in the casing (10) cavity has solder bumps (14) on an active surface, to couple the chip to the casing substrate (15). An empty space (16) is formed between the active surface and substrate. The integrated circuit is surrounded by a blocking encapsulating material (13) after the chip is connected to the substrate. The encapsulating material does not fill the empty space. The encapsulating material is coated by a filling material (11).
