发明名称 Film removing device for resin molded material
摘要 According to a film removing device, a film-coated resin molded material having a film coated on one surface of a matrix resin is flattened by a flattening roll in a heating chamber. Further, the film-coated resin molded material is fed between a peeling roll and a feeding roll of roll type rolling means for rolling and stretching. The velocity of a peeling surface of the peeling roll is made relatively higher than the velocity of a feeding surface of the feeding roll, whereby a difference in elongation between the matrix resin and the film, and a shearing force are produced to peel the film. An applicator type supply device supplies a liquid as frictional force reducing means (e.g. water) to the peeling surface and the feeding surface. Thus, a frictional force is reduced, and stretching accompanying rolling fully works. Consequently, the film becomes easy to fracture and peel, and its peeling can be performed effectively.
申请公布号 US5932066(A) 申请公布日期 1999.08.03
申请号 US19970959665 申请日期 1997.10.29
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 UWAJI, TESUO;TAKEUCHI, NAOKAZU;INAGAKI, YUJI;IKEYA, TORU
分类号 B29B17/00;B29B17/02;B29C63/00;(IPC1-7):B32B35/00 主分类号 B29B17/00
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