| 摘要 |
A method for establishing a thermal interface between an electrical component and a heat sink including the selection of a compound having a melt temperature above the normal operating temperature of the component. The compound may be placed on a carrier gasket or the like for insertion between the component and the heat sink. Upon initial heat up of the component, the component heats beyond its normal operating temperature due to an inefficient thermal joint among the component, solidified compound and heat sink. The electrical component initially reaches an initial operating temperature sufficient to cause the compound to deform or melt and fill the spaces between the mating surfaces of the component and heat sink. Once the compound resolidifies, a thermal joint is permanently established which precludes the component from heating beyond its normal operating temperature upon subsequent operation. As the normal operating temperature of the component is below the melt point of the compound, the compound will remain in a solid state. The compound is selected so as to deform only during initial component operation so as to avoid the problems of liquification, including the mess associated with silicon greases, the decrease in conductivity of a compound when liquified and the tendency of a liquified compound to flow away from the thermal joint.
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