| 摘要 |
PROBLEM TO BE SOLVED: To provide a punch whose strength is improved by preventing the generation of a local buckling load, a working device using the same and a manufacturing method for a semiconductor device. SOLUTION: In the punch with which a member to be treated is blanked and formed into a desired shape, a holding part 22, straight part 26 which is integral with the holding part 22 and has approximately equal thickness and shape to those of the bottom end surface abutted on the member to be treated and notched part 32 which is formed in the side part of the straight part 26 and whose boundary part is formed into a curved shape are provided. |
