发明名称 METHOD FOR FORMING ISOLATION FILM OF SEMICONDUCTOR DEVICE
摘要 A method of forming an isolation layer of a semiconductor device, comprising the steps of defining a semiconductor substrate with a cell region and a peripheral region; forming a first buffer layer on the peripheral region of the semiconductor substrate; forming a second buffer layer on the cell region of the semiconductor substrate and on the first buffer layer; forming an anti-oxidation layer on the second buffer layer to define an active region; and forming a field insulation layer in the cell and peripheral regions of the substrate by oxidation.
申请公布号 KR100214469(B1) 申请公布日期 1999.08.02
申请号 KR19950067326 申请日期 1995.12.29
申请人 HYUNDAI MICRO ELECTRONICS CO.,LTD. 发明人 WHANG, HYEON-SHANG
分类号 H01L21/316;H01L21/32;H01L21/76;H01L21/762;H01L21/8239;H01L21/8242;H01L27/105;(IPC1-7):H01L21/76 主分类号 H01L21/316
代理机构 代理人
主权项
地址