Thermosetting organopolysiloxanes for mounting electrical and electronic devices

摘要

Thermosetting organopolysiloxanes containing a platinum-containing inclusion compound as catalyst, and optionally polysaccharide derivatives are new. The thermosetting organopolysiloxanes contain: (A) organopolysiloxanes with an SiC bonded residue containing multiple aliphatic C-C residues; (B) organopolysiloxanes with an Si-bonded H atom, or, in place of (A) and (B); (C) organopolysiloxanes containing an SiC-bonded residue with multiple aliphatic C-C compounds and an Si-bonded H atom; and (D) a platinum containing inclusion compound, and optionally polysaccharide derivatives selected from starch, amylose, cellulose, and amylopectin. An Independent claim is included for a molded body obtained by crosslinking the organopolysiloxane.