| 摘要 |
PURPOSE:To solder-plate an outer lead after resin-sealing in a short time by providing two housings separably movable with a mask having a mask part for masking a lead frame of a periphery of the lead on both surfaces of a resin package of a semiconductor device. CONSTITUTION:The plating machine comprises first and second housings 2 so relatively separably movable as to hold a semiconductor product from both surface sides. Each housing 1 or 2 has a first mask flared to mask both surfaces of a resin package 33 of a semiconductor device, a second mask 12 for masking a lead frame of a periphery of an outer lead 34, and a hollow part 17 for surrounding the outer lead. Further, a solder plating solution inputting slit 14 connected to the part 17 and a solder plating solution discharging groove 15 are formed, an electrode 16 is provided partly on an inner wall of the part 17 in such a manner that a positive voltage is applied to the electrode 16 and a negative voltage is applied to the lead 34 from a power source. |
